Silicon wafer polishing machine should try to get the maximum polishing rate so as to remove the damaged layer as soon as possible. At the same time, the polishing damage layer will not affect the final observed structure, that is, it will not cause false structure. The former requires the use of coarse abrasives to ensure a larger polishing rate to remove the polished damaged layer; the latter requires the use of the finest material to make the polishing damage layer shallow, but the polishing speed is low, so it is necessary to adjust the distance between the polishing head and the worktable. To achieve the best contact effect, throw the best effect. Manual waxing can be used in the polishing process to reduce the cost of machine manufacturing.
Silicon wafer polishing machine can also Polish curved surface, sanitary ware, hardware handle in the process of polishing higher requirements, so the quality of polishing machine is also very important. The number of workpieces is closely related to the weight and the shape of the workpiece. Therefore, the workpiece is slowly put in to increase, and the rotation of the inverted workpiece slows down. However, it is not allowed to keep the workpiece still. When the workpiece does not move and rotate, the polishing solution will be uneven and the polishing time will be lengthened unnecessarily. Key points of operation: before polishing silicon wafer polishing machine, the surface of the workpiece must be cleaned. The polishing fluid cannot remove a large amount of oil dirt, otherwise the workpiece, polishing needle, water and polishing barrel may be blackened. Cleaning solution must be used when cleaning polishing needle and polishing barrel.

In engineering equipment, it has gradually replaced some metal parts, but ceramic materials also have an obvious disadvantage, that is, it is not easy to cut by double-sided grinder. At present, in the application of engineering ceramics, most of them are formed parts. In the double-sided grinding machine processing of ceramic materials, plane cutting is more mature. Most of the parts made of engineering ceramics are pressed and sintered by double-sided grinder. The main machining surface is plane, and the plane cutting is mainly by single-sided grinding. However, some ceramic parts need to be grinded by double-sided grinder at the same time to ensure the quality requirements of parts.
The abrasive inside the double-sided grinder is a mixture of abrasive and water or oil. According to the workpiece hardness and machining allowance, different specifications of abrasives can be selected. According to their sources, grinding can be divided into natural abrasives and artificial abrasives. Natural abrasives include diamond, corundum and garnet. Artificial abrasives include synthetic diamond, artificial corundum, silicon carbide, magnetized boron, etc.
Corundum is the crystal of alumina (Al2O3). The specific gravity of natural corundum is 3.9-400, and that of artificial corundum is 3.2-4.0. Alumina has great toughness and Vickers hardness is more than 2000.